Samith Radhakrishnan
SVP Analytics Head
1. Chip Research and Design - India - can we see an innovation similar to space tech
This is initial stage, where the concept & design of the semiconductor chip, defining its
architecture, logic, and functionality. It involves extensive simulations & testing before a physical prototype is created. Innovation and performance improvements occur here. This is where cutting edge technology like AI, 5G, and data centers originate.
This stage requires large investments in talent (engineers, architects), specialized design
software (EDA tools), and IP licensing. A significant portion of R&D budgets is used here.
Companies like NVIDIA, Intel, AMD, and Qualcomm excel in design. EDA tool providers
Synopsys & Cadence play critical roles.
AI and quantum computing chip design is an emerging field, with companies and startups rapidly growing in this space.
2. Fabrication - Only Tata (TEPL) and Adani
This is where the designed chips are physically built on silicon wafers. This process involves
complex equipment to etch, deposit, and ion implant materials onto the wafers to create billions of tiny transistors. Fabrication is where the magic happens at the atomic level. The ability to shrink transistor size (e.g., to 5nm, 3nm) defines performance and efficiency.
Building and maintaining a fab costs billions of dollars (often $10B+ for advanced nodes). The
equipment itself is highly specialized and expensive (EUV lithography machines from ASML).
Major foundries include TSMC, Samsung, and Intel, GlobalFoundries is another key player.
There is a huge push toward regionalizing fabs to avoid supply chain dependencies, especially in India, Europe and the U.S.
3. OSAT (Outsourced Semiconductor Assembly and Test) - In India Kaynes, Suchi Semicon
After fabrication, the silicon wafers are diced into individual chips. The chips then go through
packaging and testing to ensure functionality before they can be integrated into electronic devices. Packaging is crucial for protecting the chip, managing heat, and connecting it to other components in devices. Testing ensures no defects, as faulty chips could disrupt entire systems.
OSAT operations are capital-intensive but less so than fabs. They require advanced testing
equipment and skilled technicians. ASE Group, Amkor Technology, and SPIL, Kaynes Semicon
are among the leading OSAT companies.
OSAT companies are innovating in advanced packaging technologies like 2.5D and 3D packaging.
4. ATMP (Assembly, Test, Mark, Pack) -India Tata (TSAT), Micron, CG power
ATMP encompasses all the stages after wafer fabrication, including assembling the chips into
packages, marking them, and final testing. It's a final quality control step before chips are sent out to device manufacturers.
ATMP involves significant investment in equipment and automation. ASE, Amor , Powertech
Tech, and Unisem are leaders.
Advanced chiplet are driving growth in this stage.
Ref: LinkedIn Article; ET Article
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